BSU leverages 30+ years of experience in advanced PCB Assembly technology, with proven processes and a full range of services. From prototyping, low volume high mix to medium-high volume manufacturing, we provide these PCBA services from our advanced facility in Austin, TX. Here are some of our capabilities:

• 0201 components, Fine pitch and high count BGAs, Package on Package (POP), Chip on Board, fiber optics, RF microelectronics, press fit and high density connectors
• Hybrid processes (tin-lead and lead-free or RoHS), pin through hole, wave & selective soldering, double and single sided reflow, wide body and backplanes
• Quick turn prototype assembly, RoHS compliance certification, conformal & parylene coating
• Inspection and testing using the latest SPI, AOI, Flying probe and X-Ray equipment
• Comprehensive electrical testing and test system development for boundary scan, in-circuit test (ICT), Flying Probe, functional test and burn in test (BIT)